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Journal of Renewable and Sustainable Energy / Volume 4 / Issue 1 / SPECIAL TOPIC: SELECTED PAPERS FROM THE PHOTOVOLTAIC TECHNICAL CONFERENCE, AIX EN PROVENCE, FRANCE, 2011

J. Renewable Sustainable Energy 4, 011603 (2012); http://dx.doi.org/10.1063/1.3656330 (5 pages)

Insulation and diffusion barrier characteristics of spin-on-glass layer on a stainless steel substrate

Ming-Jer Jeng1, Wei-Jer Lai1, Bai-Zong Chang2, and Sung-Cheng Hu2

1Department of Electronic Engineering and Green Technology Research Center, Chang Gung University, Taiwan
2Chemical Engineering Section, Chemical Systems Research Division Chung-Shan Institute of Science and Technology, Taiwan

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(Received 23 July 2011; accepted 5 October 2011; published online 8 February 2012)

The efficiency of CIGS (Copper Indium Gallium diSelenide) solar cells fabricated on stainless steel foil is lower than that on soda-lime glass substrates due to the lack of sodium incorporation and metal impurity diffusion. A dielectric barrier is necessary to prevent metal impurity diffusion for stainless steel substrates. Spin-on-glass (SOG) coatings are characterized by their lower cost and larger area than other vacuum deposition methods. By using spin coating SOG to deposit SiOx barrier layers, this study investigates the characteristics of their insulation and impurity barrier. For insulation property, a higher curing temperature is preferred. The insulation does not further improve when the curing temperature exceeds 400 °C. The SiOx film resistance can be as high as 108 Ω when the voltage is smaller than 10 V. For impurity barrier characteristics, although thick thickness is preferred, it easily incurs thermal cracking. To effectively barricade metal impurity diffusion, the influence of SiOx thickness is larger than that of curing SOG temperature.

© 2012 American Institute of Physics

Article Outline

  1. INTRODUCTION
  2. EXPERIMENTS
  3. RESULTS AND DISCUSSIONS
  4. CONCLUSIONS

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KEYWORDS and PACS

Keywords

curing, diffusion barriers, impurities, insulating thin films, silicon compounds, spin coating, thermal stress cracking

PACS

  • 66.30.Ny

    Chemical interdiffusion; diffusion barriers

  • 68.55.Ln

    Defects and impurities: doping, implantation, distribution, concentration, etc.

  • 68.60.Bs

    Mechanical and acoustical properties

  • 81.40.Np

    Fatigue, corrosion fatigue, embrittlement, cracking, fracture, and failure

  • 62.20.mt

    Cracks

  • 68.55.aj

    Insulators

ARTICLE DATA

Digital Object Identifier
http://dx.doi.org/10.1063/1.3656330

PUBLICATION DATA

ISSN

1941-7012 (online)

Publisher

$abstract.society.value is a Member of CrossRef American Institute of Physics

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